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A critical need in developing thermal interface materials (TIMs) is an understanding of the effect of particle/matrix conductivities, volume loading of the particles, the size distribution, and the random arrangement of the particles in the matrix on the homogenized thermal conductivity. Commonly, TIM systems contain random spatial distributions of particles of a polydisperse (usually bimodal) nature...
Thermal interface materials (TIMs) are widely used in the microelectronics industry to adequately expel the waste heat generated in the chips, by reducing the contact resistance between the chip and the heat sink. A critical need in developing these TIMs is apriori modeling using fundamental physical principles to predict the effect of particle volume fraction and arrangements on effective behavior...
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