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In this paper, to achieve the real-time joystick control of redundant manipulators, two schemes are proposed and investigated: one scheme is a cosine-based position-to-velocity mapping, which maps the position of the joystick in the motion range to the velocity of the robot end-effector for the real-time end-effector velocity generation; and the other is a real-time joystick-controlled motion planning...
Low-temperature bonds are thin intermetallic (IMC) bonds that are formed between devices when plated layers of different metals on each side of the component come into contact under relatively low temperature and high pressure. These joints, comprised of completely of IMC compounds, will fail in a sudden unexpected manner as compared to normal solder joints, which fail in a ductile manner, where cracks...
Low temperature bonds are thin intermetallic bonds that are formed between devices when plated layers of different metals on each side of the component come into contact under relatively low temperature and high pressure. These joints comprised completely of intermetallic compounds, will fail in a sudden unexpected manner, compared to normal solder joints which fail in a ductile manner where cracks...
Low temperature bonding technology is developed using In-alloy on Au at a low temperature below 200??C forming robust intermetallics (IMC) joints with high re-melting temperature (>300??C), so that after bonding the IMC joints can withstand the subsequent processes without any degradation. Using similarly solder system and methodology, chips to wafer (C2W) bonding method has been developed, as...
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