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Heavy Al wire wedge bonding is a dominant technique for power packages with high voltage. The parameters that impact the wedge bonding quality are mainly bonding process related and material related. Possible failure modes for wire bonding are non-stick of bond wire to the pad, die surface cratering or peeling of pad metallization, and wire break. In this paper, the dielectric damage under the top...
A new type of full thermal parametric model for power wafer level chip scale package (WL-CSP) is developed in this paper, which includes parametric WL-CSP and its adaptive parametric JEDEC thermal test board. By employment of the parametric model, package geometry parameters and the trace layout for PCB can easily be changed to meet the requirement of design, so that the influence of all geometry...
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