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In this paper, a comprehensive modeling is carried out to investigate the dynamic behaviors of WL-CSP subjected to both flat and vertical drop impacts. The non-linear dynamic properties include solder, Cu pad and the metal stacking under the UBM. Both of the JEDEC standard flat drop test and the vertical drop test modeling for different solder bump height are studied. The results showed that, in the...
A new type of full thermal parametric model for power wafer level chip scale package (WL-CSP) is developed in this paper, which includes parametric WL-CSP and its adaptive parametric JEDEC thermal test board. By employment of the parametric model, package geometry parameters and the trace layout for PCB can easily be changed to meet the requirement of design, so that the influence of all geometry...
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