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In order to optimize the dispersion structure of the filler in polymer composites, 15 nm SiO2 (HL‐150) and 6 nm SiO2 (HL‐380) are added to epoxy (EP). The total content of silica filler is fixed at 15 wt%, and the mass ratio of HL‐380 to HL‐150 in silica filler is adjusted. SiO2/EP nanocomposites are prepared by the sand milling and heat curing process. Transmission electron microscopy results show...
Al2O3 nanoparticles have been successfully synthesized by hydrothermal process. Subsequently, epoxy (EP) nanocomposites incorporating the Al2O3 nanoparticles have been fabricated. The morphologies of the Al2O3 nanoparticles and the nanocomposites were characterized by scanning electron microscopy (SEM). Dielectric properties of these nanocomposites are strongly related to both the morphology of the...
Silica nanostructure hollow spheres were synthesized using template method and the silica hollow spheres/epoxy nanocomposite was prepared by adding the silica hollow spheres modified by aminophenyl trimethoxysilane (APTMOS) into the epoxy resin. Dielectric properties were investigated in terms of frequency and filler concentration. The results showed that the introduction of the silica hollow spheres...
In order to investigate the roles of inorganic nanoparticles on improving breakdown behavior of Al2O3/PI film, the DC breakdown characteristics were studied in this paper. The morphology and element distribution of zones near the breakdown holes were observed by SEM and electron spectroscope for both the original PI film and Al2O3/PI nanocomposite film. The experimental results showed that the electrical...
Inorganic nanohybrid polyimide (PI) film has great potential for applications in the areas of electrics and electronics because of its excellent electrical performance, such as the resistance to aging and corona and so on. The breakdown strength of insulating materials is generally measured by DC, AC or impulse voltage. However, the influence of laser irradiation to Al2O3/ PI film has not been reported...
In the paper, the chemical structure and dielectric properties including dielectric constant epsiv and dielectric loss tandelta of organic-inorganic polyimide/silica composite films, made through sol-gel process and thermal imidization, using pyromellitic dianhydride and 4,4'-oxydianiline as organic precursors and methyl-triethoxysilane as inorganic precursor, were investigated. A coupling agent of...
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