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In this paper, the effect of gold amount on the gold embrittlement of solder balls in wafer-level chip-scale package (WLCSP) CSP 80 is investigated. First, precisely controlled amounts of gold were added artificially to solder balls through a reflow process. It is found that for CSP 80 without Au, after 2000 h of thermal aging at 150 degC, the solder balls still fail in the bulk solder. When Au is...
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