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The thermal management for FC (flip chip) on the LTCC has to be better understood, in order to meet this requirement. Therefore a DoE (design of experiment) was developed and LTCC-thickness, thermal vias, heatspreader and underfill were used as parameters. The test die has a heating resistor to simulate the power loss in the amplifier and a diode circuit. With the voltage drop over the diode, the...
The current trend towards miniaturization and higher power dissipation offers new challenges for a system in package. This leads to new combinations of materials with different physical properties, processes and designs. (Brunner, 2005) One example of this development is the PAiD-module (power amplifier with integrated duplexer) where a power amplifier is mounted together with a SAW-filter (surface...
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