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Among the most advanced microelectronic packages, ball-grid-array (BGA) technology are expected to have increasing applications because of their higher input-output connection density achieved through area-array solder joints. In this study, the role of 0.5 wt % Cu in the interfacial reaction between the Sn-3.5%Ag solder and the electroless Ni-P metallization on the BGA substrate was investigated...
This study employed an electroless Ni-P-carbon nanotubes (Ni-P-CNTs) composite coating as a pad finish for electronic packaging. It aimed at investigating the effect of carbon on the mechanical behavior and microstructure of ball grid array (BGA) solder joints after multiple reflows. Electroless Ni-P and electroless Ni-P-CNTs composite coatings with the same P-content were prepared for comparison...
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