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As soldering process is a high temperature phenomenon accompanied by surface reaction kinetics, the computational model for solder bubble growth can be a strong arena for describing those aspects which are otherwise difficult to be understood through the experimental methods. In this paper, the growth of gaseous bubbles in the molten tin solder has been modeled using finite element method. The advection-diffusion...
As soldering process is a high temperature phenomenon accompanied by surface reaction kinetics, the computational model for solder bubble growth can be a strong arena for describing those aspects which are otherwise difficult to be understood through the experimental methods. In this paper, the growth of gaseous bubbles in the molten tin solder has been modeled using finite element method. The advection-diffusion...
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