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A broadband silicon PSR is presented with an insertion loss lower than ∼0.7dB/0.3dB and crosstalk lower than 12.1dB/14.7dB for TE and TM mode respectively. By combining the PSR with AWG and Germanium PDs, an integrated polarization insensitive DWDM receiver is further demonstrated.
This paper presents thermal characteristics of rotor-side converter (RSC) in doubly-fed induction generator (DFIG) wind turbines (WTs). A numerical power loss and thermal model simulator has been developed to obtain instantaneous junction temperature of power devices for a wide operating range of RSCs. Thermal performance of four RSC candidates, including Si IGBT based 2L / 3L-NPC / 3L-ANPC RSCs and...
Aiming at related task scheduling in cloud computing, a cost-effective precedence constrained tasks scheduling algorithm is presented. The algorithm takes into account the monetary cost and tries to fulfill a task scheduling balancing time and cost. In order to explore more possible solutions with high quality ignored by the deterministic algorithm, multi-population genetic algorithm is adopted to...
In this work, the importance of the channel mismatch effect in degrading the performance of deployed quantum LDPC codes has been pointed out. We help remedy this situation by proposing new quantum LDPC decoding strategies that can significantly reduce performance degradation by as much as 50%. Our new strategies for the quantum LDPC decoder are based on previous insights from classical LDPC decoders...
A multiscale hierarchical lithium-ion battery (LIB) anode composed of Si shells coaxially coated on vertically aligned carbon nanofibers has been explored. A high Li storage capacity of ∼3,000–3,500 mAh (gSi)−1 and > 99% Coulombic efficiency have been obtained. Remarkable stability over 500 charge-discharge cycles have been demonstrated. Particularly, this electrode present a high-rate capability...
A semi-analytic approach for the electromagnetic analysis of large numbers of Through silicon vias (TSV) is presented in this paper. The method is based on cylindrical mode expansion method. The scattering and multi reflection effects between the vertical cylindrical vias are considered by expanding the electromagnetic waves surrounding the vias by cylindrical waves. As the method fully captured the...
A semi-analytic approach for the electromagnetic analysis of large numbers of Through silicon vias (TSV) is presented in this paper. The method is based on cylindrical mode expansion method. The scattering and multi reflection effects between the vertical cylindrical vias are considered by expanding the electromagnetic waves surrounding the vias by cylindrical waves. As the method fully captured the...
In this paper we investigate novel soft mutual information forwarding (MIF) protocols in a two-way relay channel (TWRC), where two sources exchange information with the help of an intermediate relay. Based on the estimated signals from the two sources, the relay calculates the soft mutual information, and then broadcasts it to the two sources. In specific, we propose two MIF protocols, namely, network...
In this paper, two kinds of compact waveguide structures based on through glass vias (TGVs) technology are proposed. A full-wave simulator on the basis of finite element method is applied to analyze the transmission characteristics of these structures. The return loss S11, transmission S21 and electric field distribution results show that they have the similar signal transmission performance of the...
In this paper the nanotubes obtained by silicon atoms substitutionally doping the armchair single-walled carbon nanotubes were investigated by quantum chemistry calculations under the framework of density functional theory. The geometrical structures, relative stabilities and electronic properties of the fifteen Si-doped tubes were studied in details and compared with those of the pristine (5, 5)...
We discuss titanium dioxide material development for CMOS compatible fabrication and integration of athermal silicon photonic components. Titanium dioxide overclad ring modulators achieved athermal operation (< 0.2 GHz/°C).
3D integration technology, especially TSV (Through Silicon Via) based 3D package is a feasible solution for high density and high performance system. The TSV provides a vertical interconnection with a much shorter electrical delay between dies. The EMI (Electromagnetic Interfere) issue draws great attention due to the short vertical distance between noise source circuit and sensitive circuit. In this...
This paper introduces a package of a high-speed and high-density switching ASIC with over 1000 pins and hundreds of high-speed transmission lines crowded in two layers of the substrate, and also demonstrates Signal Integrity (SI) and Power Integrity (PI) implementation. In order to route the transmission lines with minimum distortion, crosstalk and attenuation, routing is co-designed with die and...
Based on the diffrent features between the streaming service and web service, the authors proposed a novel Flow Cycle Caching Algorithm, and prompted 3 new metrics, First Demand Without Delay Rate, Jump Demand Without Delay Rate and Caching Benefit Rate, which fit for streaming media server inherent characteristics of performance standards. Through comparing various caching algorithms under these...
This paper characterizes optimal keyword auction mechanism, obtains Revenue Equivalence Theorem for keyword auctions and designs a kind of optimal keyword auction mechanism by considering the variable costs of advertisement positions. Under assumptions that the valuation of advertisement position to the advertiser is independently identically distributed, that the click-through rate depends only on...
Differential interconnect lines in multi-gigabits system in package (SiP) packaging system are studied in this paper. The performance of interconnect lines can be easily estimated with jitter and eye opening using the eye diagram that is very helpful metric. To maintain good eye-diagram with high voltage swing and low timing jitter, a signal integrity (SI) design flow of SiP is proposed based on eye-diagram...
In this paper we introduce the concepts of compatibility function for fuzzy value with respect to t-operation. By using ??-cuts of fuzzy value we present the calculation formula of compatibility function for continuous fuzzy value and give the expression of compatibility function corresponding to the seven commonly used t-operations.
A new kind of polymer inorganic coagulant-PFSiS (Poly Ferric Silicate Sulphate) coagulants, at different Fe/Si molar ratios and B values (B=OH/Fe) were prepared. Then, the turbidity removal efficiency of PFSiS in treating kaolin suspension was investigated. The results showed that turbidity was removed highly by using PFSiS under the certain conditions. Moreover, FTIR analysis indicated that Si participated...
To get the optimization shape of polysilicon electrostatic micromotor, the method of the combination of genetic algorithm (GA) and FEM analysis is studied. Fitness value is calculated by ANSYS, and the genetic algorithm is realized by APDL language. Simple genetic algorithm is improved by self-adaptive big mutation operation, and the big mutation operation is utilized to avoid premature when the number...
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