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To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance. This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films (NPCf) as bonding layer. Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by means of heating-alloy method, then the precursor alloy was immersed into the dilute...
Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities interdiffusion, minimizing thermal stresses between heterogeneous materials, minimizing voids and other defects, and reducing the cost. In this work, a novel low temperature thermocompression bonding technology using nanoporous Cu (NPC) was proposed and the influences of different...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities interdiffusion, minimizing thermal stresses between heterogeneous materials, minimizing voids and other defects, and reducing the cost. In this work, a novel low temperature thermocompression bonding technology using nanoporous Cu (NPC) was proposed and the influences of different...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance. This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films (NPCf) as bonding layer. Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by means of heating-alloy method, then the precursor alloy was immersed into the dilute...
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