The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The effect of annealing conditions on defects and post CMP grain size in electroplated Cu lines is discussed. We have studied the effect of these parameters on interconnect reliability by measuring the electromigration of 'via-fed' structures. A failure criterion of 2% change in initial resistance was used for EM rather than the traditional 20% used for aluminum interconnect. The electromigration...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.