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A new design methodology and 3D additive fabrication process is used to demonstrate a 16-Way medium power amplifier (MPA) at G-band frequency range. Advanced high bandwidth, high gain and power InP DHBT three stage MMIC is used for the MPA integration, capable of 50mW output power and >20 dB small signal gain. Novel micro-machined WR4 to CPW transitions are used to accommodate the MMICs and connect...
A new design and fabrication methodology for mmw and sub-mmw components is defined. The 3D copper additive manufacturing process is described with a full 3D volumetric 16 way splitter-combiner demonstration at G-band frequency range. The WR4 combiner is folded through design compaction and then sliced through its Z-direction and fabricated as slices to form a final 23 slice stack. The stack was then...
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