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This paper is to evaluate the thermal performances of a Direct Plated Copper (DPC) substrates attached on a high performance MCPCB thermal board for high brightness LED (HBLED) applications. The advantages of DPC substrate compared to traditional Direct Bond Copper (DBC) substrate include: more robust bonding between the substrate and copper metallization, ability to offer substrates with a wide range...
Typical photolithography rework process involves a resist wet strip following by a dry descum process. It is found that the de-lamination phenomena correlate to longer descum timing in the rework route. Hypothesis of the de-lamination suggests a change in the surface roughness of TiN after being subjected to descum process. This hypothesis is supported by various experiments conducted. Surface morphology...
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