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Implementation of thick Cu inductor in IC chips has been a highly challenging task for Far-backend packaging industry. One of the major concerns is that the thicker Cu trace wrapped by re-passivation polymer layers (Polymer-1 & Polymer-2) is often accompanied by remarkable internal stress in the overall package, which is plagued with the risk of layer-to-layer delamination and/or interface micro-cracks...
A facile route to synthesis silver nanoparticles into polyvinylpyrrolidone (PVP) or silica (SiO2) matrices using sol-gel method has been developed. The influence of matrices on the size and optical properties of silver nanoparticles were studied. Because the particle size increases at different rate with silver nitrate (AgNO3) concentration in different matrices, there is an up-limit for AgNO3 concentration...
Based on a series of cyclic differential scanning calorimetry analyses together with thermogravimetric analyses, the effects of carbon nano-powder and moisture on the glass transition temperature of a polyurethane shape memory polymer were separated and qualitatively identified. This approach should be applicable to other polyurethane polymers and their composites.
A rather unusual failure mode transition from brittle to ductile at high strain rates occurs under a combined pressure and shear loading. This transition also represents a change in the failure mode from a normal stress dominated fracture mode at low loading rates to a shear stress dominated shear banding failure at high strain rates. While most such observations have been in metallic materials, where...
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