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Multilayers of Cu/Ni were electodeposited on monocrystalline Si (100) and polycrystalline copper foil substrates using a single bath containing nickel sulphamate, copper sulphate and boric acid. Voltammetric studies allow establishing the suitable potentials for Cu pure and Ni rich single layer. Based on these studies lower activity of silicon than cooper substrate was stated. SEM investigations confirm...
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