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Based on surface effect of nanoparticles, excellent Cu-Cu bonding was achieved by sintering of Cu nanosolder paste. The surface melting behavior of nanoparticles and the bonding process was investigated at the temperature of 250°C to 400°C under the protection of Argon/Hydrogen gas mixtures. The antioxidative Cu nanoparticles were synthesized with high yield by an efficient method for the preparation...
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