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The c-BN grain has been brazed with Cu–Ni–Sn–Ti filler metal in vacuum at 1373K holding for 600s. The microstructure of the interface between c-BN grain and Cu–Ni–Sn–Ti filler metal has been studied using scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS). The composition of the interface has been analyzed by X-ray diffraction analyzer (XRD). Experimental results showed...
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