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Two embedded micro-wafer-level packages (EMWLP) with 1) laterally placed and 2) vertically stacked thin dies are designed and developed. Three-dimensional stacking of thin dies is demonstrated as progressive miniaturization driver for multi-chip EMWLP. Both the developed packages have dimensions of 10 mm × 10 mm × 0.4 mm and solder ball pitch of 0.4 mm. As part of the development several key processes...
Developments of ultra fine pitch and high density solder microbumps and assembly process for low cost 3D stacking technologies are discussed in this paper. The solder microbumps developed in this work consist of Cu and Sn, which are electroplated in sequential with total thickness of 10 mum; The under bump metallurgy (UBM) pads used here is electroless plated nickel and immersion gold (ENIG) with...
High density three dimensional (3D) interconnects formed by high aspect ratio through silicon vias (TSVs) and fine pitch solder microbumps are presented in this paper. The aspect ratio of the TSV is larger than 10 and filled with Cu without voids; there are electrical nickel and immersion gold (ENIG) pads on top of the TSV as under bump metallurgy (UBM) layer. On the Si chip, Cu/Sn solder microbumps...
Developments of ultra fine pitch and high density solder microbumps for advanced 3D stacking technologies are discussed in this paper. CuSn solder microbumps with 25 ??m in pitch are fabricated at wafer level by electroplating method and the total thicknesses of the platted Cu and Sn are 10 ??m. After plating, the micro bumps on the Si chip are reflowed at 265??C and the variation of bump height measured...
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