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Attachment of semiconductor devices to a package substrate is essential for providing electrical and structural connections as well as a heat dissipation path. The die-attach materials play a vital role in ensuring the system performance and reliability. As the electronics industry continues to integrate more functions in smaller packages, the electrical, thermal and mechanical properties of the existing...
Summary form only given. Nanoscale silver paste is a promising material for device interconnection. It can be sintered at 300 degC or lower, has superior thermal, electrical and mechanical properties over silver and can withstand higher service temperatures. The paste, consisting of silver nanopowder and an organic binder system, was used to attach SiC devices on silver and gold-metallized Ni-coated...
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