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In this paper, a low thermal-resistance packaging substrate for white light-emitting diodes (LEDs) which used a silicon substrate with cavities and through-silicon vias was designed, fabricated, and tested. The substrate was composed of a silver-layer-coated light-reflection cup and ultrathin silicon-based with micro through-vias filled with copper for electrical interconnection and heat dissipation...
Light emitting diodes (LEDs) hold the promise for efficient, lightweight and environmental-friendly lighting sources, which is regarded as the next-generation lighting technology. Since so many problems still remain to be solved, this emerging technology has attracted the attention of a large number of researchers. Among several issues frequently discussed in the community, the long-time reliability...
As one type of the chip attachment materials, the solder layer inside the light-emitting diode (LED) packages can not only bond the chips to the substrate tightly, but also play the role of thermal interface material (TIM). Therefore, it makes a great influence on the thermal performance LED packages, especially in high density chip-array LED packaging. The solder layer has become one of the dominant...
The phenomenon that phosphor particles tend to settle in silicone is widely known. Recent researchers have discussed the effects of phosphor concentration on luminous efficacy of LED packaging. But to produce reliable products, mechanical and interfacial considerations are also essential. In this paper, the mechanical behaviors and interfacial strength of silicone with different levels of phosphor...
As the most promising candidate for the realization of high-efficiency light sources for general lighting, the high power lighting emitting diodes (LEDs) still have reliability issues that hinder the large scale application of LED devices. Nowadays, the reliability is becoming an essential barrier for LED devices to substitute the traditional light sources. Before it is applied into mass production,...
In a typical LED package module, a grease layer forms the interface between the substrate and copper heat spreader. We propose to carve grooves on the aluminum substrate to form an array of protruding posts. Three types of grooves are designed to measure interface thermal resistance. A preliminary feasibility study shows obvious improvement in the thermal resistance of the interfaces for the formation...
As a newly lighting source, high power white light emitting diodes (LEDs) have many excellent performances and begin to be widely used. The LED street light fixture is one of the most typical and popular applications, which is studied and developed worldwide. However, those studies mainly focused on its light efficiency, light pattern, color temperature, and so on, few concentrated on the reliability...
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