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The crystallinity of electroplated copper thin-film interconnections varies drastically depending on its manufacturing process, and thus, their mechanical and electrical properties change significantly depending on their micro texture. These changes should cause the variation of the residual stress in the interconnections, and thus, electronic performance of devices and the lifetime of interconnections...
There were local distributions of the crystallinity and resistance in a test interconnection. The local resistance of the interconnection varied with the local crystallinity. The maximum temperature appeared in the local area with the minimum crystallinity, in other words, the area with the highest resistance under the application of high current density of 10 MA/cm2. Thus, local high Joule heating...
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