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Vacuum brazing of Ti3SiC2 ceramic and Cu was carried out by using Ag-Cu-Ti active solder and Ag-Cu inactive solder, respectively. The objective of this study was to investigate experimentally the contributions of two brazing mechanisms, reaction mechanism and diffusion mechanism, on the mechanical property of brazing joints. The results revealed that the reaction mechanism and diffusion mechanism...
Diffusion bonding of TiAl intermetallic to Ti 3 AlC 2 ceramic was carried out using Zr and Ni foils as interlayer. The interfacial microstructure and joining properties were characterized by electronic microscopy investigation and shear strength test, respectively. The microstructure observations revealed that the general interfacial microstructure of the joint bonded at 850 °C was...
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