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In article number 2004659, Sun‐Kyung Kim, Youngmin Choi, Sunho Jeong, and co‐workers propose multi‐dimensional particles that allow for deep penetration of incident photons in the surface‐conformal laser writing process. Highly conductive 3D Cu features for form‐factor free electrical circuits are created simply via successive 3D printing and laser writing processes.
Recently, the fabrication of 3D circuits has attracted significant attention in the context of the realization of a new‐generation of printed electronics. In particular, form‐factor free Cu conductors have been recognized as the key to a constituent layer that can interconnect on demand a variety of active/passive components on arbitrarily designable platforms. However, even with their characteristic...
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