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Wafer level integration of MEMS with IC will dramatically improve integration efficiency and reduce production cost. However, up to date, the large residual stress and the none-flat surface of MEMS processed wafers are still intractable problems. Besides, the expensive through-silicon vias (TSVs) process and the limitation of both die size and wafer size in wafer level integration are other difficult...
This paper presents our recent progress on a flexible and size-free MEMS-IC integration process for MEMS ubiquitous applications in wireless sensor network (WSN). In our proposal, MEMS and IC known-good-dies (KGD) are temporarily bonded onto carrier wafer with rapid and high-accurate self-alignment by using hydrophobic surface assembled monolayer (SAM) fine pattern and capillary force of H2O; and...
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