The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The effectiveness of thermal chemical-vapor-deposited (CVD) manganese oxide (MnOx) for their application in the copper (Cu)-through-silicon-via (TSV) structure as a barrier layer was investigated by X-ray photo-electron spectroscopy (XPS), transmission electron spectroscopy (TEM), and capacitance-voltage (C-V) measurements. TEM data revealed the conformal growth of 20 nm-thick MnOx on the surface...
We develop new via-last backside-via 3D integration technologies using a unique temporary adhesive system in which visible-light laser is employed for wafer debonding from glass carriers. The advanced 3D and TSV researches are driven in order to fabricate Si interposers with high-density TSVs and highly integrated 3D hetero chips at Global INTegration Initiative (GINTI) as a new system integration...
Multi-layer 3D chip stacking by a surface-tension-driven self-assembly technique is demonstrated. After multi-layer self-assembly, memory chips having Cu-SnAg μbump and Cu-TSVs are bonded on a substrate by thermal compression to confirm electrical joining between them. In addition, we investigate the impacts of wetting properties of chip/substrate surfaces, μbump shapes, and μbump layout on alignment...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.