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Capacitive micromachined ultrasonic transducer (CMUT) fabricated in standard CMOS and post-CMOS processes undergoes a series of thermal processes at about 1000degC. Thermal stress is generated in the membrane during such process. This paper studies the most severe influence of thermal stress on the performance of CMUT, such as stiffness, collapse voltage, resonant frequency, transformer ratio, coupling...
It's always difficult to model the real 3-D capacitive micromachined ultrasonic transducer (CMUT) because of the nonlinearity and filed coupling. An alternative solution is to build a 1-D equivalent model which is enough to acquire the desired behavior of CMUT. However, it's hard to obtain the 1-D equivalent parameters of the real 3-D CMUT. This paper proposes such a theoretical model to calculate...
It is always difficult to optimize parameters of capacitive micromachined ultrasonic transducers (CMUT) because of high computational cost of Finite Element Method (FEM) analysis and prototype manufacturing cost. Thus a theoretical model is required in designing a CMUT. This paper presents such a 1-D theoretical model for CMUT reception, which makes it easier to optimize the parameters of the CMUT...
It is always difficult to optimize parameters of capacitive micromachined ultrasonic transducers (CMUT) because of high computational time cost of finite element method (FEM) analysis and economic cost of prototype manufacturing. Thus a theoretical model is required in designing a CMUT. This paper presents such a 1-D lumped model. A transfer function between output sound pressure and input AC voltage...
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