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This paper reports the evaluation and characterization of titanium-glass field-assisted bonding which is suitable for microsystem packaging, especially biocompatible ones. The influence of surface roughness, bonding voltage and temperature on bonding quality was investigated. Using a point contact anode, 1 inch titanium substrates of 200 μm-thick were successfully bonded to the soda lime glass at...
Bulk tungsten is very promising for packaging and micro-devices for its high strength, radiation resistance, high melting point and conductivity. In this paper, chemical mechanical polishing of bulk tungsten substrate was carried out. A 4 inch tungsten wafer was polished at the optimized condition with an average surface roughness of 4.63nm achieved. Bulk tungsten applications in packaging and micro-devices...
With the extensive application of high voltage power transformation and distribution apparatus such as GIS and GIL, the dielectric strength of interior supporting insulators become an important factor for equipments' safe and stable operation. In this paper, the cone-plane electrode assembly has been built to simulate the electric field distribution of the coaxial cylindrical configuration in GIS/GIL...
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