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To address the reliability challenges brought about by the accelerated reaction with the implementation of lead-free solders, an electrolessly plated Ni–Co–P alloy (3–4wt.% P and 9–12wt.% Co) was developed as the solder metallization in this study. Three compounds layers, (Ni,Co)3Sn4, (Ni,Co)3P and (Ni,Co)12P5, are formed at the reaction interface. Nano-sized voids are visible in the (Ni,Co)3P layer...
The voids formed in the Ni3P layer during reaction between Sn-based solders and electroless Ni–P metallization is an important cause of rapid degradation of solder joint reliability. In this study, to suppress formation of the Ni3P phase, an electrolessly plated Ni–Sn–P alloy (6–7 wt.% P and 19–21 wt.% Sn) was developed to replace Ni–P. The interfacial microstructure of electroless Ni–Sn–P/Sn–3.5Ag...
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