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The transition from a highly widespread lead solders to lead-free solder alloy types meant many changes in the electrical industry. This transition has brought many technological phenomena that deserve our attention and they have to be still addressed in order to improve the quality and reliability of manufacturing printed circuit boards. One of them is the presence of small crystalline formations...
Monitoring of the solder spread is one of the tools which should be used to solderability and wetability quantification. In this paper we focus on the different solder spread in correlation with different surface finishes of the PCB and different type of reflow process. In our experiment we used three types of solder pastes (one lead Sn62Pb32Ag2 and two lead free Sn95,5Ag4Cu0,5, Sn99,25Cu0,7Ni0,05...
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