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We have developed an ultra-thin micro electromechanical systems (MEMS) mirror. The thickness of the device is 5.31 μm including Si structures and actuators. It was fabricated on a silicon-on-insulator wafer on which Pt/SRO/PZT/SRO/Pt/Ti/SiO2 layers were deposited. It was easily bonded on a flexible polyimide substrate and wired using adhesive and conductive pastes, without changing the conventional...
In this paper, we present a novel sensor array manufacturing process that involves transfer printing methods using a chip mounter with a vacuum collet. Using these methods, one can mount not only ultra-thin microsensors but also microcontroller and amplifier chips required for sensor device fabrication. We successfully transfer-printed a very fragile microelectromechanical systems-based 5-mm-long,...
In this paper, we present a novel sensor array manufacturing process that involves transfer printing methods using a chip mounter with a vacuum collet. We have successfully fabricated 5× 5 array of MEMS-based very fragile ultra-thin piezoelectric strain sensors on a polyethylene naphthalate (PEN) flexible printed circuit (FPC) with etched Cu pattern. Twenty five of the piezoelectric strain sensors...
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