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The effect of nano-Bi particles on the growth of intermetallic compound (IMC) between Sn-3.0Ag-0.5Cu-xBi (x=0.0, 0.8, 1.5, 2.5, 3.5, and 4.5 wt.%) solder and Cu substrate during aging process at temperatures of 120, 150, and 190°C has been investigated in this study. Scanning electron microscopy (SEM) was used to observe the microstructural evolution of the solder joints and measure the thickness...
The effect of nano-Bi particles on the growth of intermetallic compound (IMC) between Sn-3.0Ag-0.5Cu-xBi (x=0.0, 0.8, 1.5, 2.5, 3.5, and 4.5 wt.%) solder and Cu substrate during aging process at temperatures of 120, 150, and 190°C has been investigated in this study. Scanning electron microscopy (SEM) was used to observe the microstructural evolution of the solder joints and measure the thickness...
The elastic, thermal expansion, and plastic anisotropy of Sn is examined to assess how anisotropy affects the microstructural evolution and damage nucleation processes in SAC305 solder joints. Examination of all joints in a package indicates that upon solidification, crystal orientations are nearly randomly distributed. Initial studies of cracked joints after thermal cycling showed that orientations...
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