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This paper presents a technique for predicting the temperature response of a system to arbitrary power dissipation in its constituent elements under variable air-cooling. The thermal impedance is first characterised under the available range of cooling levels. This data is used to predict the thermal response directly. Practical results show good agreement with predicted temperature waveforms. The...
In this paper, epoxy/aluminium oxide powder composites designed for use as encapsulants are produced and thermally characterised. Experimental results obtained for a variety of filler concentrations, sample thicknesses and manufacturing methods are presented and compared to analytical and empirical models from literature. Further to this the effects of modifying analytical models using experimental...
The manufacturing processes involved in producing insulated metal substrate (IMS) products are shown to lead to inconsistent thickness of the insulator layer. The electrical and thermal effect of this uneven structure is investigated when compared to a classic parallel plate approximation. Methods of modelling the inter-layer thermal conductivity and electrical capacitance of IMS products are described...
A system for projecting future device temperatures in insulated metal substrate (IMS) based systems is developed. The system utilises a Luenberger observer to estimate present device temperatures from accessible temperature measurement nodes. Future device temperatures are projected from these measurements permitting feed-forward control for active thermal management. Experimental results are presented...
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