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In this work, several design approaches are considered in the thermal analysis and enhancements of a 2.5-D package with multi chips on through silicon interposer (TSI), which include overmolding materials, metal slug, lid attachment, pin fin heat sink and fan-driven heat sink cooling. The analysis models consist of two dummy flip chips on a silicon interposer to represents the logic die and memory...
In this work, several design approaches are considered in the thermal analysis and enhancements of a 2.5-D package with multi chips on through silicon interposer (TSI), which include overmolding materials, metal slug, lid attachment, pin fin heat sink and fan-driven heat sink cooling. The analysis models consist of two dummy flip chips on a silicon interposer to represents the logic die and memory...
The present paper deals with the experimental validation of an electro-thermal simulator which is able to foresee the electrical and thermal parameters of any shaped metal interconnection driven by constant voltage or constant current in single-layer PCB. The algorithm inside the simulator has been improved to adapt to the actual experiment condition, especially adding in the thermal radiation contribution...
Ca3-xBaxCo4O9 (x = 0~0.4) bulks were prepared by sol-gel and spark plasma sintering (SPS) method, and the effects of preparation process on texture and thermoelectric properties were discussed in detail. The results show that SPS process is helpful to form texture. The bulks are composed of plate-like grains, which are aligned to (001) plane. To some extent, the orientation and density of Ca3Co4O9...
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