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Large diameter single crystal garnet films are in urgent need for the burgeoning optical communication [1] as well as novel Spintronics applications [2]. Existing growth technologies not only produce environmental toxic waste from the use of Pb but also result in a large lattice mismatch leading to high defect density, high loss and small Faraday rotation angle (FRA). To address these needs, this...
The SnPb solder ball was reflowed on the Cu film in a flow of reducing gas, and the reactive spreading process was in situ recorded by a CCD camera. On the thicker Cu films, it was observed that dewetting did not happen even if the Cu6Sn5 intermetallic compounds spalled into the liquid solder. However, on the thinner Cu films, dewetting would occur when the liquid SnPb solder consumed the underneath...
The sputter-deposited Cu thin film, coated with a thinner gold layer, was prepared into the butterfly pattern with alternating zones beween Cu thin film and Si. The eutectic SnPb solder balls with different sizes were reflowed on the butterfly pattern. As a result, the liquid solder would be selectively retained on the Au/Cu film zones. At the same time, under the energy minimization control, the...
The complex conductivity of CVD-grown graphene films between 0.1 and 1.6 THz are obtained using a non-destructive THz etalon transmittance technique. Critical parameters such as ionized-impurity scattering width and chemical potential are derived. The technique can be extended to extract the complex ac conductivity parameters of other thin conducting films or 2DEG materials with high sheet conductance.
The SnPb solder ball was reflowed on the Cu film in a flow of reducing gas, and the reactive spreading process was in situ recorded by a CCD camera. On the thicker Cu films, it was observed that dewetting did not happen even if the Cu6Sn5 intermetallic compounds spalled into the liquid solder. However, on the thinner Cu films, dewetting would occur when the liquid SnPb solder consumed the underneath...
The sputter-deposited Cu thin film, coated with a thinner gold layer, was prepared into the butterfly pattern with alternating zones beween Cu thin film and Si. The eutectic SnPb solder balls with different sizes were reflowed on the butterfly pattern. As a result, the liquid solder would be selectively retained on the Au/Cu film zones. At the same time, under the energy minimization control, the...
Summary form only given. The thin detector foil of the widely used metal resistive-type bolometer is composed of an absorber, a substrate and two meander resistors. The two resistors on the detector foil together with other two identical ones coated on a reference foil form a Wheatstone bridge. Absorption of plasma radiation causes a temperature-induced resistivity increase of the detector foil, driving...
This paper describes a biaxial-uniaxial hybridized strained CMOS technology achieved through selective uniaxial relaxation of thick SSOI, dual-stress nitride capping layer, and embedded SiGe source/drain. Through novel strain engineering, nFET/pFET Idsat enhancements as high as 27%/36% have been achieved for sub-40nm devices at 1V with 30% reduction in gate leakage current, while introducing minimum...
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