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This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0∘ and 6∘. The vertical fill of each PCB is the focus...
This paper presents the implications of the adjustable fountain wave soldering process during pin through hole (PTH) component assembly process. The PTH vertical fill was carried out experimentally by using a newly developed adjustable fountain wave soldering machine ( $${0^{\circ}}$$ 0 ∘ conveyor angle). A similar printed circuit board and components were assembled by using a conventional...
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