The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the...
Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die. These residual stresses add up to the stresses generated during thermal cycling and mechanical loading and may eventually lead to product failure. In this paper we focus on three commercial molding compounds and and analyze in detail...
This work is focused on numerical investigation of the corner delamination behavior at the chip top surface of plastic encapsulated semiconductor packages which is induced under temperature loading. Two points of interest are pursued in this study: 1) impact of mold compound (MC) material properties and 2) influence of package geometry on the delamination behavior. For the first part we identify influence...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.