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The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the...
Reliability calculations of the microelectronic packages require cure dependent viscoelastic constitutive relationship for the packaging polymers in order to predict residual stress and strain fields in the final product. The residual stresses can result in the product failure due to warpage, interfacial delamination, thermal fatigue etc. The previous work in the same group (Ernst et al. 2006, 2003)...
Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process...
During the packaging of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die. For a reliable simulation of the stresses generated in a package during cure and subsequent cooling it is essential to have accurate data for the thermal and mechanical properties of the molding compound, die, solder and substrate materials...
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