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Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
This paper reports on the strain rate dependence of the mechanical properties of aluminum-based metallization layers. Evaporated Al, sputtered Al99%Cu1%, and multilayers of mum-thick Al99%Cu1% films separated by thinner TiN/Ti layers are characterized using the bulge test, the microcompression method and the microtensile technique. Elastic, ductile and fracture parameters are extracted for strain...
Warpage is a critical issue for an electronic package molding process. Much work is done in the past to predict the warpage of a package after the cooling down from the molding process. However, there are many material models for the molding compound to predict warpage: Elastic and viscoelastic models are used, and there are even groups which use cure-dependent viscoelastic models. In this paper,...
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