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We studied a low temperature deposition of tungsten-alloy barrier and copper layers only by electroless plating, with an aim of realizing low resistance TSV with a high aspect ratio. We succeeded in successive deposition of W-Ni-P barrier layer and Cu on SiO2. Furthermore, we found that the addition of Cl ions to SPS- and PEG-plating bath significantly improved the conformal deposition property even...
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