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Ultrafine-grained (UFG) pure Cu, produced by equal channel angular pressing, was subjected to thermomechanical treatment (TMT) with stepwise deformation at rising temperature. The TMT leads to homogeneous subgrain coarsening according to the established inverse relation between flow stress and steady-state subgrain size and retards static recrystallization during annealing at 403K.
Stress change tests were conducted on ultrafine-grained Cu in a region where the grain size is smaller than the steady state subgrain size. After stress reduction the normal creep transients were absent, confirming subgrain strengthening in conventional grain-sized materials and a lack of steady state subgrain structure in the ultrafine-grained materials.
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