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This paper presents a 3D circuit model capable of rapidly and accurately evaluating substrate noise coupling in the context of 3D integration. Since TSVs are large and noisy structures, the evaluation of electromagnetic coupling to and from TSVs has become crucial to the design of threedimensional integrated circuits. In this work, we present a fast and accurate 3D circuit model to this end. The model...
To estimate the impact of metal-voiding on the frequency-dependent transmission line parameters of the CMOS interconnection, lumped elements have been introduced to the numerical technique. Alternating-direction implicit (ADI) and pseudo-spectral time-domain (PSTD) methods is combined, together with the lumped elements. A three-dimensional ADI-PSTD scheme is adopted to describe the circuit passive...
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