The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Since the 50Sn32Pb18Cd eutectic solder was melted at 145 °C which is lower than the melting point of 63Sn37Pb solder (183 °C), it was selected as the interconnection joint to create a temperature gradient to avoid the former nearby 63Sn37Pb joint re-melted during the components assembly process. The tensile testing and the microstructure analysis were carried out on 50Sn32Pb18Cd eutectic solder to...
Since the 50Sn32Pb18Cd eutectic solder was melted at 145 °C which is lower than the melting point of 63Sn37Pb solder (183 °C), it was selected as the interconnection joint to create a temperature gradient to avoid the former nearby 63Sn37Pb joint re-melted during the components assembly process. The tensile testing and the microstructure analysis were carried out on 50Sn32Pb18Cd eutectic solder to...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.