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In this work, epoxy diane oligomer ÉD-20 is used to form nanocomposite materials, polyethylene polyamine is used as a hardener, ultradispersed diamond with a particle size of 4–6 nm is used as a filler. The epoxy diane resin ÉD-20 was heated to 353 K. Then the ÉD-20 oligomer and the nanofiller were subjected to hydrodynamic mixing and subsequent ultrasonic treatment of the obtained composition. The...
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