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This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surface-activated bonding at a relatively low bonding temperature of 150degC. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm times 2.8 mm times 1 mm thick) was fabricated...
We report successful bonding of photodiodes on glass substrate using Au stud bumps by Au-Au surface-activated bonding at a relatively low bonding temperature of 150degC. A glass substrate with the flip-chip bonded photodiode chips was then vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au surface-activated bonding. Applying this technique, compact and thin optical microsensors...
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