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In this study, chip scale packaging (CSP) for piezoresistive pressure sensors using a dry-film shielding approach is demonstrated. Experimental results reveal that the silicon membrane of the pressure sensor is free of metal-deposition contamination and functionally operational. The packaged pressure sensor met all of the specifications of an unpackaged bare pressure sensor, holding a maximum sensing...
In this study, a chip scale packaging (CSP) of piezoresistive pressure sensors using a dry-film shielding approach is demonstrated. A sensing-channel just above the silicon membrane of the pressure sensor has to be reserved in the package body. To prevent the silicon membrane of the pressure sensors from the metal-deposition contaminations, a dry-film with a redistribution pattern is used to shield...
Depending on the duration of exposure at supraphysiological temperatures, cellular proteins and organelles would suffer structural alternation and irreversible denaturation which may induce cell death. In the present study, a commercial hotplate was used to provide a constant temperature to heat the human embryonic kidney cells (293 T). Heat transfer model were performed to evaluate thermal equilibrium...
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