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A silicon micromachining process has been developed to fabricate high-aspect-ratio coplanar waveguide (hicoplanar). A new closed-form analytical transmission line model that is valid for both conventional coplanar waveguide (CPW) and hicoplanar is introduced and compared with simulations and experimental results. The major novelties of the model are that it includes the effect of the conductor height...
In this study, a chip scale packaging (CSP) of piezoresistive pressure sensors using a dry-film shielding approach is demonstrated. A sensing-channel just above the silicon membrane of the pressure sensor has to be reserved in the package body. To prevent the silicon membrane of the pressure sensors from the metal-deposition contaminations, a dry-film with a redistribution pattern is used to shield...
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