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Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration (L-S EM) were investigated under a current density of 5.0 × 103 A/cm2 at 230 oC. When Cu atoms were under downwind diffusion, L-S EM enhanced the cross-solder diffusion of Cu atoms to the opposite Ni side compared with the liquid-solid reaction case, resulting in the formation of...
Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration (L-S EM) were investigated under a current density of 5.0 × 103 A/cm2 at 230 oC. When Cu atoms were under downwind diffusion, L-S EM enhanced the cross-solder diffusion of Cu atoms to the opposite Ni side compared with the liquid-solid reaction case, resulting in the formation of...
The effect of the concentration gradient lies in the solder on the interfacial reaction was investigated in this paper. Sn-9Zn/Sn double layers solders were reacted with Cu at 250°C for 1–5min. The concentration gradient and its direction affect the composition and the morphology of the reaction products. When the reflow time was less than 3min, the reaction products were Cu5Zn8 and CuZn5, only Cu...
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