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This study serves to validate the predictive finite element modeling approach for the solder joint thermal fatigue life analysis, with emphasis on the applicability to various lead-free solder joints. The three packages involved in the study are 8??8 mm PBGA, l0??l0 mm QFN, and 51??51 mm CBGA. They are designed to consist of SAC387, SAC305, ??SAC305 ball + SAC387 paste?? and ??SAC387 ball + SAC305...
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