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The growth of interfacial intermetallic compounds (IMC) and consumption of metal substrate during aging affect interconnection reliability. The interfacial interaction has been significantly influenced by geometric size of solder joints with the solder size shrink from macro-scale to meso-scale. In this paper, the growth behavior of IMC and consumption trend of Cu layer in Cu/Sn-3.0Ag-0.5Cu(SAC305)/Cu...
The reliability of SAC lead-free solder joints are believed to be greatly influenced by the interfacial intermetallic compounds (IMCs) between solders and substrates. Our previous works investigated the effects of minimal rare earth (RE) elements addition on the interfacial IMCs under different aging time. Experimental results showed that the appropriate RE content is 0.07wt% La in Sn-0.3Ag-0.7Cu...
Recently, the development of low-Ag Sn-Ag-Cu (SAC) solders has become a new research field in electronic packaging industry because of the braze reliability and cost concerns. In this study, the shear strength and interfacial microstructures of two kinds of low-Ag solder joints, SAC/Cu and SAC-Bi-Ni/Cu, were investigated. The results obtained affirmed that the addition of Ni and Bi in low-Ag SAC0705...
Dynamic voltage signal across solder joints during mechanical vibration test was monitored and collected real-timely with a self-designed data acquisition system. Failure process of solder joint was studied by processing and analyzing data. In the paper, lifetime of solder joint was also compared by changing solder joint location, solder joint composition and vibration acceleration. Results indicated...
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